Henkel Loctite has introduced new Loctite® Multicore® WS200, a high activity, water washable solder paste with superior cleaning characteristics. WS200 is suitable for fine pitch, high speed printing applications.

Multicore WS200 exhibits excellent print definition with long open and abandon time capabilities. This high activity flux offers excellent wetting to a wide range of surface finishes, and an exceptional reflow process window. WS200 is highly resistant to humidity and slump, and is formulated to minimize any defects due to voiding. There is no visible residue on PCBs washed up to 3 days after being reflowed. WS200 is available with standard ANSI J-STD-006 Type 3 tin lead alloys.

Tested in accordance with ANSI J-STD-004, WS200 is classified as ORH1. This paste meets or exceeds test specifications of ANSI/J-STD-004 and 005 for SIR, corrosion, fluorides, and slump. The product also meets Bellcore GR-78-CORE tests for electromigration and SIR. Slump-resistant WS200 decreases defects due to bridging.

For more information on Loctite® Multicore® WS200, visit the Electronics section of the Henkel Loctite Web site.