Henkel Loctite has introduced new Multicore® LF320, a lead-free solder paste optimised for reflow in air on a wide range of PCB assembly applications. Reflow profiles may also be extended with nitrogen.

Multicore® LF320 requires a minimum peak reflow temperature of only 229°C, versus the common 240°C minimum. This 10°C advantage provides a comfortable safety margin when reflowing temperature sensitive components. Higher Dt assembly designs can be reflowed in air at up to 260°C.

With a print speed range of 25 to 100mms-1 (6”s-1) and an abandon time up to two hours, LF320 offers excellent wetting on a wide range of surface finishes. The solder paste has been formulated to provide high resistance to slump and solder balling. Typical end use applications include automotive, telecommunications, consumer products, and computer assemblies including mother boards and back planes.

LF320 is classified as ROMO (J-STD 004) and meets or exceeds Bellcore GR-78-CORE tests for electromigration.

For more information on Multicore® LF320 or the wide range of products offered, contact us or visit the Electronics section of the Henkel Loctite Web site.